plate and a plastic factory-snap-on cover. The cover does
mounting or wiring. Removable terminal blocks are used
wired before or after mounting.
The Engineering Card and Upgrade Kit are susceptible to damage
by static electricity and therefore the appropriate precautions
should be taken.
3.1 INTRODUCTION
There are two versions of the Engineering Card. The MODBUS Interface
Kit can only be fitted to the Mk 2 Engineering Card.
With the Engineering Card removed from the rack, the type of
Engineering Card can be visually identified as follows:
a. Mk I hardware by the presence of only one 28 pin DIL IC socket on
the card pcb.
b. Mark II hardware by the presence of two 28 pin DIL IC sockets and
a rectangular cutout near the centre of the card pcb. (See Figure 7).
A summary of the MODBUS Interface installation procedure is shown
below:
a. Unpack and check the contents of the kit.
b. Remove the Engineering Card from the rack.
c. Install the Software Expansion EPROM Integrated Circuit.
d. Install the RAM Expansion Integrated Circuit.
e. Install the MODBUS Interface Module.
f. Wire the DC Input Card terminal blocks to the host computer.
g. Configure and Commission
After installation is complete perform the commissioning procedures
outlined in Section 5. The following sections provide a detailed
explanation of the installation operations.
3.2 UNPACKING
On receipt carefully unpack the equipment observing any instructions
printed on or contained in the packaging. Check the contents for
transit damage and ensure that the following items are present:
